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 HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : HE6001 Issued Date : 1996.02.26 Revised Date : 2002.07.12 Page No. : 1/3
HJ31C
NPN EPITAXIAL PLANAR TRANSISTOR
Description
The HJ31C is designed for use in general purpose amplifier and switching applications.
Absolute Maximum Ratings (Ta=25C)
TO-252
* Maximum Temperatures Storage Temperature ............................................................................................ -55 ~ +150 C Junction Temperature .................................................................................................... +150 C * Maximum Power Dissipation Total Power Dissipation (Tc=25C) ...................................................................................... 15W * Maximum Voltages and Currents BVCBO Collector to Base Voltage..................................................................................... 100 V BVCEO Collector to Emitter Voltage.................................................................................. 100 V BVEBO Emitter to Base Voltage............................................................................................ 5 V IC Collector Current............................................................................................................... 3 A
Characteristics (Ta=25C)
Symbol BVCBO BVCEO ICES ICEO IEBO *VCE(sat) *VBE(on) *hFE1 *hFE2 fT Min. 100 100 25 10 3 Typ. Max. 20 50 1 1.2 1.8 50 Unit V V uA uA mA V V Test Conditions IC=1mA, IE=0 IC=30mA, IB=0 VCE=100V, VEB=0 VCE=60V, IB=0 VEB=5V, IC=0 IC=3A, IB=375mA VCE=4V, IC=3A VCE=4V, IC=1A VCE=4V, IC=3A VCE=10V, IC=500mA, f=1MHz
*Pulse Test: Pulse Width 380us, Duty Cycle2%
MHz
HJ31C
HSMC Product Specification
HI-SINCERITY
MICROELECTRONICS CORP.
Characteristics Curve
Current Gain & Collector Current
100 1000 VCE(sat) @ IC=8IB
Spec. No. : HE6001 Issued Date : 1996.02.26 Revised Date : 2002.07.12 Page No. : 2/3
Saturation Voltage & Collector Current
125 C
o
Saturation Voltage (mV)
25 C
o
hFE
25 C
o
75 C
o
75 C 100 125 C
o
o
hFE @ VCE=4V
10 1 10 100 1000 10000
10 1 10 100 1000 10000
Collector Current-IC (mA)
Collector Current-IC (mA)
ON Voltage & Collector Current
10000 VBE(ON) @ VCE=4V 10.0
Switching Time & Collector Current
VCC=30V, IC=10IB1=-10IB2
1000
Switching Times (us).. .
ON Voltage (mV)
25 C
o
1.0
Tstg
125 C
o
75 C Ton Tf
o
100 1 10 100 1000 10000
0.1 0.1 1.0 10.0
Collector Current-IC (mA)
Collector Current (A)
Capacitance & Reverse-Biased Voltage
100
100000
Safe Operating Area
10000
PT=1ms PT=100ms
Collector Current-IC (mA)
Capacitance (pF)
Cob 10
1000
PT=1s
100
10
1 0.1 1 10 100
1 1 10 100
Reverse-Biased Voltage (V)
Forward Voltage-VCE (V)
HJ31C
HSMC Product Specification
HI-SINCERITY
MICROELECTRONICS CORP.
TO-252 Dimension
A C
Spec. No. : HE6001 Issued Date : 1996.02.26 Revised Date : 2002.07.12 Page No. : 3/3
Marking:
H 31C Date Code J
B
D
Control Code
L
F
G
Style: Pin 1.Base 2.Collector 3.Emitter
3 H E K 2 I 1 J
3-Lead TO-252 Plastic Surface Mount Package HSMC Package Code: J *: Typical
DIM A B C D E F
Inches Min. Max. 0.0177 0.0217 0.0650 0.0768 0.0354 0.0591 0.0177 0.0236 0.2520 0.2677 0.2125 0.2283
Millimeters Min. Max. 0.45 0.55 1.65 1.95 0.90 1.50 0.45 0.60 6.40 6.80 5.40 5.80
DIM G H I J K L
Inches Min. Max. 0.0866 0.1102 *0.0906 0.0354 0.0315 0.2047 0.2165 0.0551 0.0630
Millimeters Min. Max. 2.20 2.80 *2.30 0.90 0.80 5.20 5.50 1.40 1.60
Notes: 1.Dimension and tolerance based on our Spec. dated May. 05,1996.
2.Controlling dimension: millimeters. 3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 4.If there is any question with packing specification or packing method, please contact your local HSMC sales office.
Material:
* Lead: 42 Alloy; solder plating * Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0
Important Notice:
* All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC. * HSMC reserves the right to make changes to its products without notice. * HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. * HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
Head Office And Factory:
* Head Office (Hi-Sincerity Microelectronics Corp.): 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C. Tel: 886-2-25212056 Fax: 886-2-25632712, 25368454 * Factory 1: No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C Tel: 886-3-5983621~5 Fax: 886-3-5982931
HJ31C
HSMC Product Specification


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